A full factorial experiment is proposed to optimize stencil printing for a 0.3mm process. The assembly will be in Singapore, so management wonders if temperature and humidity control will be needed. The stencil aperture is 6x4x30 mils, +/- 10% of this volume is the proposed spec. The factors are Type 4 paste (1=ACME, 2=AJAX, 3=Kostco), stencil (efab, laser), humidity (30, 45, 60 RH), temperature (20, 25, 30 C). The two replicate data are in the worksheet “Solder Paste DOE.” Set up the experiment with the factors in this order and do not randomize runs. Analyze the data, look for interactions and non linear effects. Comment on the results. What are your recommendations? There is a rumor in the industry that the AJAX paste does not print well at 20C. What do the data tell you in this regard? Do you propose further experiments, what are they?